Semiconductor Packaging Materials Market

Semiconductor Packaging Material Market Size, Share, Statistics & Trends Analysis Report By Product Type (Substrates, Lead frames, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer Level Packaging Dielectrics, Others), By Technology (Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package, Others), By End-user (Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, Others) Based On Region, And Segment Forecasts, 2024 – 2030


Report
  • Product Id: BMRC 2911
  • Pages: 300
  • Publish Date: Apr-2024
  • Category: Packaging
VishalSawant
Vishal Sawant
Business Development
vishal@brandessenceresearch.com
+91 8830 254 358
AjayRana
Ajay Rana
Business Development
ajay@brandessenceresearch.com
+91 7447 409 162
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Segmentation
Segments

Segmentation

Semiconductor Packaging Material Product Type Outlook

  • Substrates
  • Lead frames
  • Bonding Wires
  • Encapsulants
  • Underfill Materials
  • Die Attach
  • Solder Balls
  • Wafer Level Packaging Dielectrics
  • Others

Semiconductor Packaging Material Technology Outlook

  • Grid Array
  • Small Outline Package
  • Dual Flat No-Leads
  • Quad Flat Package
  • Dual In-Line Package
  • Others

Semiconductor Packaging Material End Use Industry Outlook

  • Consumer Electronics
  • Aerospace & Defense
  • Healthcare
  • Communication
  • Automotive
  • Others

 

Country
Regions and Country

North America

  • U.S.
  • Canada

Europe

  • Germany
  • France
  • U.K.
  • Italy
  • Spain
  • Sweden
  • Netherlands
  • Turkey
  • Switzerland
  • Belgium
  • Rest of Europe

Asia-Pacific

  • South Korea
  • Japan
  • China
  • India
  • Australia
  • Philippines
  • Singapore
  • Malaysia
  • Thailand
  • Indonesia
  • Rest of APAC

Latin America

  • Mexico
  • Colombia
  • Brazil
  • Argentina
  • Peru
  • Rest of South America

Middle East and Africa

  • Saudi Arabia
  • UAE
  • Egypt
  • South Africa
  • Rest of MEA
Company
Key Players

Keyplayers

  • Henkel,
  • Hitachi Chemical Company
  • Sumitomo Chemical Co., Ltd.
  • Kyocera Chemical Corporation
  • Toray Industries, Inc.
  • Powertech Technology, Inc.
  • Tianshui Huatian Technology Co. Ltd
  • Fujitsu Semiconductor Limited
  • UTAC Group
  • Chipmos Technologies Inc
  • Chipbond Technology Corporation
  • Intel Corporation
  • Samsung Electronics Co. Ltd
  • Unisem (M) Berhad
  • Interconnect Systems, Inc. (ISI)

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