Advanced Semiconductor Packaging Market
Advanced Semiconductor Packaging Market Size, Share, Statistics & Trends Analysis Report By Packaging Type (Fan-out Wafer-Level Packaging, Fan-in Wafer-Level Packaging, Flip Chip, 2.5/3D), By Applications (Processor/ Baseband, Central Processing Units/Graphical Processing Units, Dynamic Random Access Memory, NAND, Image Sensor, Others), By End-user (Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics, Others) Based On Region, And Segment Forecasts, 2024 – 2030
- Product Id: BMRC 2910
- Pages: 300
- Publish Date: Apr-2024
- Category: Packaging
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Segments
Segmentation
Packaging Type
- Fan-out Wafer-Level Packaging
- Fan-in Wafer-Level Packaging
- Flip Chip
- 5/3D
Application
- Processor/ Baseband
- Central Processing Units/Graphical Processing Units
- Dynamic Random Access Memory
- NAND
- Image Sensor
- Others
End-user
- Telecommunications
- Automotive
- Aerospace and Defense
- Medical Devices
- Consumer Electronics
- Others
Regions and Country
North America
- U.S.
- Canada
Europe
- Germany
- France
- U.K.
- Italy
- Spain
- Sweden
- Netherlands
- Turkey
- Switzerland
- Belgium
- Rest of Europe
Asia-Pacific
- South Korea
- Japan
- China
- India
- Australia
- Philippines
- Singapore
- Malaysia
- Thailand
- Indonesia
- Rest of APAC
Latin America
- Mexico
- Colombia
- Brazil
- Argentina
- Peru
- Rest of South America
Middle East and Africa
- Saudi Arabia
- UAE
- Egypt
- South Africa
- Rest of MEA
Key Players
Keyplayers
- Advanced Micro Devices, Inc.
- Intel Corporation
- Amkor Technology
- STMicroelectronics
- Hitachi, Ltd.
- Infineon Technologies AG
- Avery Dennison Corporation
- Sumitomo Chemical Co., Ltd.
- ASE Technology Holding Co., Ltd.
- KYOCERA Corporation
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