Semiconductor Manufacturing Equipment Market
Semiconductor Manufacturing Equipment Market Size, Share & Trends Analysis Report By Front-End Equipment (Lithography, Wafer Surface Conditioning, Deposition, Cleaning, Others), By Back-End Equipment (Assembly And Packaging, Dicing, Bonding, Metrology, Testing), By Fab Facility Equipment (Automation, Chemical Control, Gas Control, Others), By Product (Memory, Foundry, Logic, MPU, Discrete, Analog, MEMS, And Others), By Dimension (2D, 2.5D, 3D), By Supply Chain Participant (OSAT Companies, IDM Firms, Foundries) Based On Region, And Segment Forecasts, 2022 - 2028
- Product Id: BMRC 1843
- Pages: 300
- Publish Date: Nov-2022
- Category: Semiconductor
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Segments
By Front-end Equipment:
- Lithography
- Wafer Surface Conditioning
- Deposition
- Cleaning
- Others
By Back-end Equipment:
- Assembly and Packaging
- Dicing
- Bonding
- Metrology
- Testing
By Fab Facility Equipment:
- Automation
- Chemical Control
- Gas Control
- Others
By Product:
- Memory
- Foundry
- Logic
- MPU
- Discrete
- Analog, MEMS, and Others
By Dimension:
- 2D
- 5D
- 3D
By Supply Chain Participant:
- OSAT Companies
- IDM Firms
- Foundries
Regions and Country
North America
- U.S.
- Canada
Europe
- Germany
- France
- U.K.
- Italy
- Spain
- Sweden
- Netherlands
- Turkey
- Switzerland
- Belgium
- Rest of Europe
Asia-Pacific
- South Korea
- Japan
- China
- India
- Australia
- Philippines
- Singapore
- Malaysia
- Thailand
- Indonesia
- Rest of APAC
Latin America
- Mexico
- Colombia
- Brazil
- Argentina
- Peru
- Rest of South America
Middle East and Africa
- Saudi Arabia
- UAE
- Egypt
- South Africa
- Rest of MEA
Key Players
- Tokyo Electron
- LAM Research
- ASML
- Applied Materials
- KLA-Tencor
- Screen Semiconductor Solutions
- Hitachi High Technologies
- Nikon
- Hitachi Kokusai
- ASM International
- CSUN Manufacturing
- Kenmec Mechanical Engineering
- Mirle Automation
- Gallant Precision Machining (GPM)
- Usun Technology
- Contrel Semiconductor Technology
- many others
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